{"id":305,"date":"2020-10-30T09:45:55","date_gmt":"2020-10-30T09:45:55","guid":{"rendered":"https:\/\/sii.ua\/?case-study=arm-sc300-based-chip-card-development"},"modified":"2020-10-30T09:45:55","modified_gmt":"2020-10-30T09:45:55","slug":"arm-sc300-based-chip-card-development","status":"publish","type":"case-study","link":"https:\/\/sii.ua\/en\/case-study\/arm-sc300-based-chip-card-development\/","title":{"rendered":"ARM SC300-based chip card development"},"content":{"rendered":"<h2>The challenge<\/h2>\n<ul>\n<li>The new ARM SC300 based chip card with enhanced security solutions, awaited by key manufacturers of smart devices.<\/li>\n<\/ul>\n<h2>What we did<\/h2>\n<p>Built-in chip (ROM) start-up and initialization system development:<\/p>\n<ul>\n<li>flash &amp; ROM based initialization,<\/li>\n<li>life cycle management.<\/li>\n<\/ul>\n<p>Built-in chip (ROM) test framework development:<\/p>\n<ul>\n<li>virgin device handling,<\/li>\n<li>secure card code loading to RAM and NVM,<\/li>\n<li>built-in chip test procedures (ROM),<\/li>\n<li>wired communication,<\/li>\n<li>security features using symetric &amp; asymetric primitives.<\/li>\n<\/ul>\n<p>Flash services layer development (ROM &amp; NVM part):<\/p>\n<ul>\n<li>basic flash operations: erase &amp; program,<\/li>\n<li>extended flash operations: erase check, content integrity verification,<\/li>\n<li>multi-page erase &amp; bulk erase operations,<\/li>\n<li>flash retrimming, static wear levelling,<\/li>\n<li>transaction system &amp; empty pages pool,<\/li>\n<li>handling errors in saving of memory pages.<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>The challenge The new ARM SC300 based chip card with enhanced security solutions, awaited by key manufacturers of smart devices. &hellip; <a class=\"continued-btn\" href=\"https:\/\/sii.ua\/en\/case-study\/arm-sc300-based-chip-card-development\/\">Continued<\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"template":"views\/single-old-case-study.blade.php","offering":[204],"industry":[1107],"client":[26],"technologies":[955,956,270,281,277,269,278,273,295,549,957,682],"country":[],"class_list":["post-305","case-study","type-case-study","status-publish","hentry","offering-embedded-systems","industry-high-tech-semiconductors","client-nxp-en","technologies-ant-2","technologies-arm-sc300-2","technologies-assembler","technologies-collabnet","technologies-eclipse","technologies-embedded-c","technologies-ibm-doors","technologies-java","technologies-jenkins","technologies-junit-2","technologies-keil-2","technologies-tcl-2"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/case-study\/305"}],"collection":[{"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/case-study"}],"about":[{"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/types\/case-study"}],"author":[{"embeddable":true,"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/users\/1"}],"wp:attachment":[{"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/media?parent=305"}],"wp:term":[{"taxonomy":"offering","embeddable":true,"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/offering?post=305"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/industry?post=305"},{"taxonomy":"client","embeddable":true,"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/client?post=305"},{"taxonomy":"technologies","embeddable":true,"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/technologies?post=305"},{"taxonomy":"country","embeddable":true,"href":"https:\/\/sii.ua\/en\/wp-json\/wp\/v2\/country?post=305"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}